Laser processing robot Previous page
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The laser processing robot applies robot technology to laser processing, and realizes more flexible laser processing operations through high-precision industrial robots. The system is operated online via the teach pendant and can also be programmed offline. The system generates a model of the workpiece by automatically detecting the workpiece, and then generates a machining curve, which can also be directly processed by using CAD data. It can be used for laser surface treatment, punching, welding and mold repair of workpieces.
Key technologies include:
(1) Laser processing robot structure optimization design technology: The large-scale frame type body structure is adopted to ensure the accuracy of the robot while increasing the working range.
(2) Error compensation technology of robot system: For the integrated processing robot with large working space and high precision, combined with its structural characteristics, the hybrid robot compensation method based on non-model method and model-based method is used to complete the geometric parameter error. Compensation for errors with non-geometric parameters.
(3) High-precision robot detection technology: Combining the three-coordinate measurement technology with the robot technology, the robot achieves high-precision online measurement.
(4) Language processing technology for laser processing robot: According to the characteristics of laser processing and robot operation, the language of laser processing robot is completed.
(5) Network communication and offline programming technology: It has serial communication, CAN and other network communication functions to realize the monitoring and management of the robot production line; and realize the offline programming control of the upper computer to the robot.
Vacuum robot
A vacuum robot is a robot that operates in a vacuum environment and is mainly used in the semiconductor industry to realize the transmission of wafers in a vacuum chamber. Vacuum manipulators are difficult to import, restricted, large in quantity, and versatile, which has become a key component that restricts the R&D progress of semiconductor equipment and the competitiveness of the whole machine. Moreover, foreign countries have severely reviewed Chinese buyers and attributed them to the embargoed product catalogue. Vacuum manipulators have become a "card neck" problem that seriously restricts the manufacture of semiconductor equipment in China. The direct drive vacuum robot technology belongs to the original innovative technology.
Key technologies include:
(1) New configuration design technology of vacuum robot: Through structural analysis and optimization design, avoiding international patents, design new configuration to meet the requirements of vacuum robot for stiffness and expansion ratio.
(2) Large gap vacuum direct drive motor technology: involving large gap vacuum direct drive motor and high clean direct drive motor to carry out motor theoretical analysis, structural design, manufacturing process, motor material surface treatment, low speed and large torque control, small multi-axis drive etc.
(3) Design of multi-axis precision shafting system in vacuum environment. The design of the shaft in the shaft is used to reduce the problem of misalignment between the axes and the inertia of the inertia.
(4) Dynamic trajectory correction technology: Through the fusion of sensor information and robot motion information, the offset between the reference position between the wafer and the finger is detected, and the motion trajectory is dynamically corrected to ensure that the robot accurately takes the wafer from the vacuum chamber. One station in the room is transferred to another station.
(5) Vacuum robot language conforming to SEMI standard: The vacuum robot special language is completed according to vacuum robot handling requirements, robot operation characteristics and SEMI standards.
(6) Reliability system engineering technology: In IC manufacturing, equipment failure will bring huge losses. According to the high requirements of MCBF for semiconductor equipment, the reliability of each component is tested, evaluated and controlled to improve the reliability of each component of the robot, thus ensuring that the robot meets the high requirements of IC manufacturing.
Clean robot
A clean robot is an industrial robot used in a clean environment. As the level of production technology continues to increase, its requirements for the production environment are increasingly demanding. Many modern industrial products are required to be produced in a clean environment. Clean robots are the key equipment for production in a clean environment.
Key technologies include:
(1) Clean lubrication technology: By using negative pressure dust suppression structure and non-volatile grease, it can achieve no pollution to the environment and meet the cleanliness requirements.
(2) High-speed and smooth control technology: Through the trajectory optimization and improved joint servo performance, the smoothness of clean handling is achieved.
(3) Miniaturization technology of the controller: According to the high construction and operation cost of the clean room, the footprint of the clean robot is reduced by the miniaturization technology of the controller.
(4) Wafer inspection technology: Through the optical sensor, it is possible to obtain information such as missing or tilted wafers in the cassette by scanning the robot.