3. Ultra-precision cutting technology using diamond tools 3.1 Advances in ultra-precision cutting technology Ultra-precision cutting technology of diamond tools is an important part of ultra-precision machining technology. Many defense-critical products (such as gyroscopes, various flat and curved reflections) Mirrors and lenses, precision instrumentation, and various parts in high-power laser systems require machining with diamond ultra-precision cutting. Previous page next page
Ultra-precision cutting on ultra-precision machine tools using single crystal diamond tools allows for the production of highly polished mirrors. Ultra-precision cutting has a very small cutting thickness and a minimum cutting thickness of up to 1 nm. The single crystal diamond tool used for ultra-precision cutting requires a sharp edge and a radius of 0.5 to 0.01 μm. Due to the small radius of the cutting edge, the measurement of the cutting edge has been extremely difficult in the past, and it is now easy to measure with an atomic force microscope (AFM).
3.2 Research on ultra-precision cutting mechanism The research on ultra-precision cutting mechanism has made a lot of progress in recent years. For example, when ultra-precision cutting of brittle materials, the machined surface can obtain a mirror surface without producing brittle fracture marks, which involves the problem of brittle-plastic conversion of plastic cutting of brittle materials during extremely thin cutting. Recently, many new ideas have been proposed. From the experimental results of ultra-precision cutting glass, it can be seen that the cutting thickness is very small at the beginning, the cutting mechanism is plastic removal, and there is no brittle fracture mark on the machined surface. As the thickness of the cutting increases, the plastic cutting gradually transforms into brittle fracture removal, and obvious brittle fracture marks are visible on the machined surface.
At present, the use of computer simulation and molecular dynamics simulation methods have been very effective in the study of ultra-precision cutting processes and mechanisms. On the one hand, the understanding of the mechanism of cutting and removing very thin layer materials has been deepened, and the ultra-precision cutting effect can be made at the same time. More accurate forecasts. The computer simulation simulation prediction and computer simulation of the machined surface formed by ultra-precision cutting can predict the cutting force of ultra-precision cutting of different crystal planes of single crystal aluminum. It can be seen that the cutting force in different directions is not due to the anisotropy of the crystal. equal. Using the molecular dynamics simulation of the ultra-precision cutting process, the dynamic resection process of the ultra-precision cutting ultra-thin material can be observed and analyzed, and the excision process can be animated.