Laser cutting technology is widely used in different fields

At present, mature laser processing technologies include: laser rapid prototyping technology, laser welding technology, laser drilling technology, laser cutting technology, laser marking technology, laser de-balancing technology, laser etching technology, laser trimming technology, laser storage technology, Laser scribing technology, laser cleaning technology, laser heat treatment and surface treatment technology.

Laser rapid prototyping technology integrates the latest achievements in laser technology, CAD/CAM technology and material technology. According to the CAD model of the part, the photopolymerizable material is solidified layer by layer with laser beam, and it can be accurately stacked into samples without the need of molds and tools. The rapid and precise manufacture of complex-shaped parts has been widely used in the aerospace, electronics, automotive and other industries.

The laser welding technology has a solution purification effect, which can purify the weld metal and is suitable for welding between the same and different metal materials. Laser welding has a high energy density and is particularly advantageous for metal welding with high melting point, high reflectivity, high thermal conductivity and physical properties.
Laser drilling technology has the advantages of high precision, versatility, high efficiency, low cost and remarkable comprehensive technical and economic benefits, and has become one of the key technologies in the field of modern manufacturing.

Laser cutting technology can be widely used in the processing of metal and non-metal materials, which can greatly reduce processing time, reduce processing costs and improve workpiece quality. Pulsed lasers are suitable for metallic materials, continuous lasers are suitable for non-metallic materials, and the latter is an important application area for laser cutting technology.

Laser marking technology is one of the largest applications for laser processing. Laser marking is a marking method that uses a high-energy-density laser to locally illuminate a workpiece, causing a chemical reaction of the surface material to vaporize or undergo a color change, thereby leaving a permanent mark. Laser marking can produce a variety of text, symbols and patterns, etc., the size of the characters can be from millimeters to micrometers, which has special significance for the anti-counterfeiting of products. Excimer laser marking is a new technology developed in recent years. It is especially suitable for metal marking and can achieve sub-micron marking. It has been widely used in microelectronics industry and bioengineering.

The laser de-balancing technique uses a laser to remove the unbalanced overweight portion of the high-speed rotating component, and the inertia axis coincides with the rotating axis to achieve the process of dynamic balance. The laser de-balancing technology has two functions of measurement and de-duplication, which can simultaneously measure and correct unbalancedly, and the efficiency is greatly improved. It has broad application prospects in the field of gyro manufacturing. For high-precision rotors, the laser dynamic balance can double the balance accuracy, and the balance accuracy of the mass eccentricity can reach 1% or a few thousandths of a micron.

The laser etching technology is simpler than the conventional chemical etching technology, can greatly reduce the production cost, and can process 0.125 to 1 micron wide lines, which is very suitable for the manufacture of very large scale integrated circuits.

The laser trimming technology can automatically fine-tune the specified resistance with an accuracy of 0.01% to 0.002%, which is more accurate and efficient than traditional processing methods and low in cost. Laser trimming includes fine-tuning of thin film resistors (0.01 to 0.6 μm thick) and thick film resistors (20 to 50 μm thick), fine tuning of capacitors, and fine tuning of hybrid integrated circuits.

Laser storage technology is a technology that uses laser to record video, audio, text data and computer information. It is one of the supporting technologies in the information age.

Laser scribing technology is the key technology for the production of integrated circuits. It has fine marking and high precision (line width is 15 ~ 25 microns, groove depth is 5 ~ 200 microns), processing speed is fast (up to 200 mm / sec), finished product The rate can reach more than 99.5%.

The use of laser cleaning technology can greatly reduce the particle contamination of processing devices and improve the yield of precision devices.

Laser heat and surface treatment technologies include: laser phase change hardening technology, laser cladding technology, laser surface alloying technology, laser annealing technology, laser shock hardening technology, laser enhanced plating technology, laser glazing technology, these technologies for changing materials Mechanical properties, heat resistance and corrosion resistance play an important role.

Laser phase transformation hardening (ie, laser quenching) is the earliest, largest, fastest and most widely used new process in laser heat treatment. It is suitable for most parts of different materials and different shapes, and can improve the wear resistance of parts. Sex and fatigue strength, some foreign industrial departments use this technology as a means to ensure product quality.

Laser cladding technology is one of the laser surface modification technologies widely used in the industry. It has good economy and can greatly improve the corrosion resistance of the product.

Laser surface alloying technology is a new method for local modification of surface materials. It is one of the most potential surface modification technologies in the future. It is suitable for use in aviation, aerospace, weapons, nuclear industry and automobile manufacturing. Parts that are resistant to corrosion and high temperatures.

Laser annealing technology is a new process for semiconductor processing, and the effect is much better than conventional thermal annealing. After laser annealing, the substitution rate of impurities can reach 98% to 99%, which can reduce the resistivity of polysilicon to 1/2 to 1/3 of ordinary heating annealing, and can greatly improve the integration degree of integrated circuits and make circuit components. The interval between them is reduced to 0.5 microns.

Laser shock hardening technology can improve the mechanical properties of metal materials, prevent the generation and expansion of cracks, improve the strength and hardness of steel, aluminum, titanium and other alloys, and improve their fatigue resistance.

Laser-enhanced electroplating technology can increase the deposition rate of metals at a speed 1000 times faster than without laser irradiation. It is of great significance for the production and repair of micro-switches, precision instrument parts, microelectronic devices and large-scale integrated circuits. The use of the modified technology can increase the firmness of the electrical layer by 100 to 1000 times.

Laser glazing technology has a promising future for material modification, its low cost, easy control and replication, and the development of new materials. Laser glazing combined with flame spraying, plasma spraying, ion deposition and other technologies have broad application prospects in controlling microstructure, improving surface wear resistance and corrosion resistance. Electronic materials, electromagnetic materials and other electrical materials are ideal for measuring instruments after laser glazing.

Diffused Silicon Pressure Sensor

The diffusion silicon Pressure Sensor adopts the diffusion silicon piezoresistive pressure sensor with stainless steel isolation film as the signal measuring element, the signal processing circuit is located in the stainless steel housing, the sensor signal is converted into standard 4-20mA current or RS485 signal output through the professional signal conditioning circuit. Widely used in petroleum, chemical, metallurgy, electric power and other industrial process on-site measurement and control.

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